Samsung Electronics targets 1nm chips by 2030

Samsung Electronics’ foundry (contract chip manufacturing) business division has set a goal to introduce the 1nm (nanometer; 1nm = one-billionth of a meter) process by 2030. The 1nm technology is referred to as a ‘dream semiconductor’ process, which involves arranging computational elements, each the size of five atomic particles, using a new method. This goal has been set to engage in full-scale technological competition with rival TSMC and secure leadership in the next-generation semiconductor market. Samsung Electronics has also decided to develop various processes within its existing cutting-edge 2nm technology to secure major clients.

According to industry sources on March 30, Samsung Electronics’ foundry business division has formulated a plan to complete the research and development (R&D) of the 1nm semiconductor process by 2030 and transfer it to mass production lines. The 1nm technology is considered a ‘dream innovative process’. This is because it signifies that the width of the elements responsible for data processing within a semiconductor chip can be reduced to 1nm. As the element width becomes half that of the current cutting-edge 2nm technology used by Samsung Electronics’ foundry business division, the process difficulty increases.

Along with element miniaturization, a new structure called ‘fork sheet’ will also be introduced in the 1nm process. Up to the 2nm process, elements were manufactured using Gate-All-Around (GAA) technology. This technology maximizes power efficiency by increasing the current path from the conventional three sides to four sides.

The ‘fork sheet’ is a technology that minimizes the distance between these GAA elements. It is a technology that builds electrically non-conductive walls between GAA elements, much like inserting a fork. For example, it’s like changing from a traditional structure where lawns were placed between houses in a village to one where massive concrete walls are erected. Just as removing lawns creates more usable space, allowing more houses to be built, this means more elements can be placed within the same chip area.

Samsung Electronics’ foundry business division ranks second in the global market. There is approximately a tenfold difference compared to TSMC, which holds nearly 70% market share. It is known that TSMC, which currently dominates the market, is also pursuing the introduction of ‘fork sheet’ in the 1nm process after 2030. The industry views that Samsung Electronics, by setting a roadmap for the 1nm process to be implemented by 2030, has prepared to engage in technological competition on par with TSMC.

Since announcing its ‘Vision for System Semiconductor No. 1 by 2030’ in 2019, Samsung Electronics has adhered to a strategy of catching up with TSMC in advanced processes. In 2019, it was the first in the world to introduce the 7nm extreme ultraviolet (EUV) lithography process, and in 2022, it was the first in the world to adopt GAA elements in the 3nm process.

An industry official stated, “While it is realistically not easy for Samsung Electronics to surpass TSMC in terms of sales or production volume, it continues to compete on the technological front,” adding, “The contract secured last year from Tesla for the supply of 2nm artificial intelligence (AI) chips, valued at $16.5 billion (approximately 25 trillion won), is a prime example of an achievement based on its technological prowess.”

Samsung Electronics’ foundry business division is currently introducing various improved processes even within its cutting-edge 2nm technology. It is developing ‘SF2T’, a customized process for the mass production of Tesla’s 2nm ‘AI6’ chip. This chip will be produced starting in 2027 at Samsung Electronics’ new foundry base, the Taylor plant in the United States.

It is also accelerating the development of new 2nm processes, such as ‘SF2P’, which will be utilized starting this year for the production of new smartphone application processors (APs) for Samsung Electronics’ System LSI Business Division, and ‘SF2P+’, which will commence operation next year. A semiconductor industry official said, “As the yield rate for the 2nm process has now exceeded 60%, increasing productivity, expectations for a turnaround to profitability this year are also growing.” BusinessKorea