TSMC plans 3-nanometre chip production launch in Japan in 2028

TSMC is expected to launch equipment installation and ​mass production of 3-nanometre wafers in 2028 at ‌its second factory in Japan, according to a Taiwanese government filing late.

In February, TSMC CEO CC Wei said the ​company plans to mass-produce advanced 3-nanometre chips at ​its second fabrication plant in Japan, during a ⁠meeting with Japan’s Prime Minister Sanae Takaichi.

Under the ​revised plan, its second chip-making plant in Japan will have ​a monthly production capacity of 15,000 12-inch wafers through advanced 3-nanometre process technology, the filing said on Tuesday.

TSMC’s previous plans for ​Japan focused on the less-advanced technologies. In 2024, the ​company said that total investment in the first and second fabs ‌would ⁠exceed $20 billion, with combined monthly production capacity of 100,000 12-inch wafers using less-advanced 40, 22/28, 12/16 and 6/7-nanometre process technologies.

Japanese newspaper Yomiuri reported in February that investment for ​the second fab ​plant will ⁠roughly touch $17 billion, but TSMC has not disclosed the figure yet and also declined ​to comment on the reported investment figure.

The ​company’s ⁠first fab plant in Japan started volume production in late 2024.

TSMC established its Japan unit, Japan Advanced Semiconductor Manufacturing, ⁠in ​2021 with support from Sony Semiconductor ​Solutions Corporation. Japan’s DENSO Corporation and Toyota Motor Corporation later joined ​as minority investors.