UMC, Polar Semiconductor sign MoU for US 8-inch wafer manufacturing

Taiwan chip maker United Microelectronics Corp said on Thursday it had signed a memorandum of understanding with U.S.-based Polar Semiconductor to explore collaboration on manufacturing of 8-inch wafers in the United States.

In a statement, UMC said the companies would identify products to be made at Polar’s recently expanded 8-inch fab in Minnesota, meeting demand from industries such as automobiles, data centres, consumer electronics, and aerospace and defence.

The partnership combines Polar’s U.S. manufacturing capabilities with UMC’s 8-inch technology portfolio and global customer base, and could support customers’ multi-sourcing strategies, the companies said.

The collaboration would help bolster U.S. 8-inch wafer manufacturing and boost supply-chain resilience amid shifting geopolitics, they added.

“This partnership is aligned with Polar’s strategy to meet the growing demand for domestic manufacturing,” said Ken Obuszewski, Polar’s vice president of marketing.

It “directly addresses our customers’ needs for more made-in-USA chips,” added Oliver Chang, UMC’s senior vice president of global sales.

Taiwan’s second-largest contract chipmaker after TSMC, UMC has most of its fabs in Taiwan, with facilities in Japan and Singapore. Reuters