TSMC aims to maintain profitability

We just decided to raise the foundry service quote from December at the earliest. TSMC Is currently trying to reduce production costs by asking suppliers to lower prices in order to maintain profitability. The foundry also New packaging technology For silicon photonic ASICs targeting the data center market segment. DRAM spot price It is declining rapidly as overall demand weakens and puts heavy pressure on contract prices.

TSMC strives to reduce costs: According to industry sources, TSMC will work with equipment and material suppliers to reduce costs by reducing prices by 15% next year.

TSMC Announces Advanced Packaging for Silicon Photonics Applications: According to industry sources, TSMC has introduced a new advanced packaging technology called COUPE (Compact Universal Photonic Engine) Heterogeneous Integration Technology for Silicon Photonic ASICs targeting the data center market.

DRAM spot prices fall sharply: According to industry sources, DRAM spot prices in August are declining rapidly, and contract prices in the fourth quarter may be under downward pressure. WorldAkkam