Thales, Radiall, FoxConn explore semiconductor assembly in France

Thales, Radiall and FoxConn announce they have initiated preliminary discussions to explore the potential creation, in France, of an industrial capacity in the field of outsourced semiconductor assembly and test (OSAT).

With a planned production capacity in excess of 100 million System In Package (SIP) per annum by 2031, this facility aims to address the European aerospace, automotive, telecoms and defense advanced packaging markets.

This initiative is expected to aggregate additional European industrial actors to sustain an investment in excess of €250m and ensure a strong European leadership for the project. ​

CT Bureau