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Japan to revitalise semiconductor industry with advanced 2nm chip production

Japan is set on revitalizing its position in the global semiconductor landscape with the upcoming production of advanced 2nm chips. The Rapidus corporation, established in August 2022, has outlined plans to commence production of these next-generation chips in the early part of 2027. A cutting-edge manufacturing facility is currently taking shape in Hokkaido, supported by a substantial fiscal stimulus from the Japanese government totaling $6.1 billion and substantial investments from prominent entities such as SoftBank, Sony, and Toyota. This significant undertaking also enjoys a technological partnership with tech giant IBM.

Henri Richard, President and GM of Rapidas Design Solutions, has confirmed that the production timeline is on course, anticipating a considerable demand for 2nm chip production. He stresses the necessity for increased production capacity amidst the backdrop of heightened geopolitical tensions and national security concerns, particularly in the tech sector.

Japan Revives Domestic Semiconductor Manufacturing
Japan’s initiative echoes recent moves by the U.S. to boost domestic chip production, as demonstrated by President Biden’s CHIPS and Science Act. After 25 years, Japan will witness the operationalization of a semiconductor fabrication plant on its soil, championed by both government leaders and private investors.

Strengthening Semiconductor Alliances
According to Henri Richard, Rapidus’ entry into the semiconductor arena provides a new and viable alternative to the current market leaders like TSMC, Samsung, and Intel. The company aims to be at the forefront of semiconductor production, offering competition while promoting a balance in geopolitical risks.

Collaborations to Foster Innovation
There is a rising interest among various tech companies, including AI startups and those focusing on edge computing, to partner with Rapidus for their chip production needs. Recent speculation points to Rapidus collaborating with Canadian company Tenstorrent for advanced AI chips employing RISC-V architecture, a move signaling Rapidus’ readiness to deliver best-in-class cycle time reduction services.

Eco-Friendly and Technologically Advanced Fabrication
In an age where environmental sustainability is paramount, Rapidus’ facility near Chitose Airport in Hokkaido is lauded for its eco-friendly design, utilising renewable energy sources and incorporating green infrastructure. Furthermore, their association with IBM on developing cutting-edge nanosheet technology points to a competitive edge in performance and energy efficiency compared to current standards.

Rapidus stands as a beacon of Japan’s return to semiconductor prominence, showcasing a powerful blend of innovation, sustainability, and strategic partnerships.

Japan’s foray into advanced 2nm semiconductor manufacturing aims to recapture its historical leadership in the semiconductor industry and meet the growing global demand for high-performance, low-power integrated circuits. Smart Phone Magazine

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