Trends
Global smartphone AP SoC market share: Q4 2021 – Q1 2023
A repository of quarterly data for the global smartphone AP market based on smartphone AP/SoC shipment numbers.
| Global Smartphone Chipset Market Share (Q4 2021 – Q1 2023) | ||||||
| Brands | Q4 2021 | Q1 2022 | Q2 2022 | Q3 2022 | Q4 2022 | Q1 2023 |
| Mediatek | 35% | 36% | 36% | 35% | 33% | 32% |
| Qualcomm | 29% | 34% | 32% | 32% | 19% | 28% |
| Apple | 20% | 14% | 13% | 16% | 28% | 26% |
| UNISOC | 11% | 11% | 11% | 9% | 11% | 8% |
| Samsung | 4% | 5% | 8% | 8% | 8% | 4% |
| HiSilicon (Huawei) | 1% | 1% | 0% | 0% | 0% | 0% |
| Others | 0% | 0% | 0% | 1% | 1% | 1% |
Highlights:
Apple: Apple’s chipset shipments will decrease in Q2 2023 due to seasonality. The Pro series is doing better. Overall iOS is doing better than the Android market and has been less affected by weak demand.
MediaTek: MediaTek’s shipments will slightly decline in Q2 2023 due to inventory correction and weak demand. LTE SoCs shipments will decline by higher single digit and 5G SoCs will grow by mid-single digit. The inventories for MediaTek are coming down and they expect a rebound in H2 2023.
The Dimensity 9200 plus was added to the premium tier. Redmi (K60 ultra series) and OPPO (one plus Nord 5 series) are launching models with the Dimensity 9200 plus in Q2 2023. The new smartphone launches will be models to come out with Dimensity this year.
Qualcomm: Qualcomm’s shipments will remain flat in Q2 2023 due to inventory drawdown. Inventories will get back to normal in a couple of quarters. Shipments in the premium segment will maintain their volume due to the adoption of Snapdragon 8 Gen 2 in Samsung flagship smartphones and chinese OEMs.
Samsung: Samsung’s shipments have slightly increased in Q2 2023. The launch of Exynos 1330 and 1380 in the mid-high and low segments in Q1 will add volumes to this segment. The company recently announced the Samsung Galaxy M14, A14 & F14, with the Exynos 1330 chipset. Exynos 850 to continue in LTE chipset in the low end.
UNISOC: UNISOC’s shipments will slightly increase in Q2 2023. UNISOC continues to gain a share in the low-tier bands (<$99) driven by its LTE portfolio. UNISOC recently launched T750 5G Chipset. We are expecting that realme and HONOR will be launching phones with a T750 chipset. The Low-end LTE market is going through weak demand and inventories have built up. It is likely to remain in H1 2023 and slowly ease out towards the end of 2023. HiSilicon: As per our checks and sell-thru data, Huawei is close to the end of the inventory for the HiSilcon chipsets. Huawei is using chipsets from Qualcomm in its new smartphones, and these have been capped at 4G. Because of the US ban Huawei cannot manufacture new chipsets from TSMC, Samsung Foundry. Counterpoint Research
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