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Samsung forms HBM development team to focus on next-Gen HBMs

Samsung Electronics has established a new “HBM Development Team”’ within its Device Solutions (DS) Division to bolster its competitiveness in high-bandwidth memory (HBM) technology. This strategic move comes just over a month after Vice Chairman Kyung-Hyun Kyung took office as head of the DS Division, reflecting the company’s commitment to staying ahead in the rapidly evolving semiconductor market.

The newly formed HBM Development Team will focus on advancing HBM3, HBM3E, and the next-generation HBM4 technology. This initiative aims to meet the surging demand for high-performance memory solutions driven by the expansion of the artificial intelligence (AI) market. Earlier this year, Samsung had already established a task force (TF) to enhance its HBM competitiveness, and the new team will integrate and elevate these existing efforts.

Since 2015, Samsung Electronics has been operating an HBM development organization within its Memory Business Division. In February of this year, the company achieved a significant milestone by developing the HBM3E 12-layer stack, the industry’s first to stack DRAM chips up to 12 layers. This product boasts the industry’s largest capacity of 36 gigabytes (GB). Samples of the HBM3E 8-layer and 12-layer stacks have already been delivered to NVIDIA for quality testing.

According to industry sources, “Samsung Electronics’ Device Solutions (DS) Division carried out an organizational restructuring centered on the establishment of the HBM Development Team.” The same sources added, “The newly established HBM Development Team is expected to focus on developing not only HBM3 and HBM3E but also the 6th generation product, HBM4 technology.”

High-bandwidth memory (HBM) is a type of memory used in high-performance computing applications, such as graphics cards, data centers, and AI processing. It is known for its high speed and efficiency compared to traditional memory types. The rapid growth of the AI market has significantly increased the demand for advanced computing technologies, including HBM. AI applications, such as machine learning and neural networks, require substantial computational power and memory bandwidth, driving the need for advanced memory solutions.

The recent leadership change within Samsung’s DS Division, with Kyung-Hyun Kyung taking office, provides context for the strategic decisions and organizational restructuring aimed at enhancing competitiveness in the HBM market. BusinessKorea

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