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PM Modi likely to lay foundation stone of 3 semiconductor plants on March 13

Prime Minister Narendra Modi is expected to lay the foundation stone of three semiconductor projects in Gujarat and Assam on March 13.

Clearances and land allocation for the semiconductor plants are being fast tracked. The construction of these plants will start in the next 100 days.

The three projects have been approved by the Union Cabinet. Details are:

1. Semiconductor Fab with 50,000 wfsm capacity:
Tata Electronics Private Limited (“TEPL”) will set up a semiconductor fab in partnership with Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan.

Investment: This fab will be constructed in Dholera, Gujarat. Investment in this fab will be Rs.91,000 crore.

Technology partner: PSMC is renowned for its expertise in logic and memory foundry segments. PSMC has 6 semiconductor foundries in Taiwan.

Capacity: 50,000 wafer starts per month (WSPM)

Segments covered:
High performance compute chips with 28 nm technology. Power management chips for electric vehicles (EV), telecom, defence, automotive, consumer electronics, display, power electronics, etc. Power management chips are high voltage, high current applications.

2. Semiconductor ATMP unit in Assam:
Tata Semiconductor Assembly and Test Pvt Ltd (“TSAT”) will set up a semiconductor unit in Morigaon, Assam.

Investment: This unit will be set up with an investment of Rs.27,000 crore.

Technology: TSAT semiconductor is developing indigenous advanced semiconductor packaging technologies including flip chip and ISIP (integrated system in package) technologies.

Capacity: 48 million per day

Segments covered: Automotive, electric vehicles, consumer electronics, telecom, mobile phones, etc.

3. Semiconductor ATMP unit for specialized chips:
CG Power, in partnership with Renesas Electronics Corporation, Japan and Stars Microelectronics, Thailand will set up a semiconductor unit in Sanand, Gujarat.

Investment: This unit will be set up with an investment of Rs.7,600 crore.

Technology partner: Renesas is a leading semiconductor company focussed on specialised chips. It operates 12 semiconductor facilities and is an important player in microcontrollers, analog, power, and System on Chip (‘SoC)’ products.

Segments covered: The CG power semiconductor unit will manufacture chips for consumer, industrial, automotive and power applications.

Capacity: 15 million per day.

This strategic move seeks to challenge the dominance of Taiwan, South Korea, and China in in the semiconductor arena.

CT Bureau

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