Chipmakers pushing advanced technologies

TSMC’s new 5nm Plus node reportedly will be able to enter mass production in the fourth quarter of 2020 with the process to be initially used for AMD’s next-generation CPUs, while Kinsus is also looking to boost its FCBGA and AiP packaging businesses, eyeing the business opportunity from 5G equipment. However, the coronavirus pandemic will continue to haunt the IT market and is expected to weaken demand for backend IC materials starting the third quarter.

TSMC to move 5nm Plus process to volume production in 4Q20: TSMC is expected to kick off volume production of chips manufactured on an enhanced version of its 5nm FinFET process, dubbed tentatively 5nm Plus, in the fourth quarter of 2020, according to sources familiar with the matter.

Kinsus gearing up to expand presence in FCBGA, AiP fields: Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from 5G applications in 2020, according to the IC substrate maker.

Backend material distributors warn of demand slowdown: IC fabrication and backend materials distributors are expected to face a slowdown in shipments starting third-quarter 2020 at the earliest due mainly to impacts of the coronavirus pandemic on terminal consumer demand and fresh US sanctions on Chinese tech giant Huawei, according to industry sources.

—Digitimes